| 发明名称 |
SEABED PRESSURE BOTTLE THERMAL MANAGEMENT |
| 摘要 |
A subsea electronics module or pressure bottle with greatly enhanced capabilities for conducting heat away from internal electronics boards by means of an adjustable heat conduction wedge system. |
| 申请公布号 |
WO2011100064(A3) |
申请公布日期 |
2011.11.24 |
| 申请号 |
WO2011US00258 |
申请日期 |
2011.02.11 |
| 申请人 |
SENSORTRAN, INC.;PARK, BRIAN |
发明人 |
PARK, BRIAN |
| 分类号 |
G01V8/00;B63C11/48;G01V13/00;H05K5/00;H05K7/20 |
主分类号 |
G01V8/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
