| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy curing agent and an epoxy resin composition which are excellent in mounting reliability and cleaning property and preferred as an underfill material and by which a substrate and a semiconductor element suffer no damage during a repair thereof, and to provide a semiconductor device and a repairing method therefor. <P>SOLUTION: The epoxy curing agent is represented by general formula (1) (where Xs may be the same as or different from each other and represent any one of a direct bond, an oxygen atom, and a sulfur atom; Ys may be the same as or different from each other and represent any one of OH, NH<SB POS="POST">2</SB>, NHR<SP POS="POST">2</SP>(where R<SP POS="POST">2</SP>represents a 1-10C alkyl group), and an acid anhydride group; R<SP POS="POST">1</SP>s may be the same as or different from each other and represent any one of an alkyl group, a fluorinated alkyl group, an aryl group, and a fluorinated aryl group; and Ar represents an aromatic ring). The epoxy resin composition contains the epoxy curing agent and an epoxy resin. <P>COPYRIGHT: (C)2012,JPO&INPIT |
