发明名称 LIGHT EMITTING DIODE CHIP AND SUPPORTING MEMBER, LIGHT EMITTING DIODE PACKAGE INCLUDING THE LIGHT EMITTING DIODE CHIP AND THE SUPPORTING MEMBER, AND LIGHT EMITTING DEVICE INCLUDING THE LIGHT EMITTING DIODE PACKAGE
摘要 <P>PROBLEM TO BE SOLVED: To provide a light emitting diode chip and a supporting member that can be assembled easily, a light emitting diode package including the light emitting diode chip and the supporting member, and a light emitting device including the light emitting diode package. <P>SOLUTION: A light emitting device according to the invention includes: at least one light emitting diode package; a printed circuit board; and at least one light guide plate. The light emitting diode package includes: a supporting member comprising a frame extending in a first direction and a plurality of branches branched from the frame; and light emitting diode chips, each of which is fixed between two branches adjacent with each other. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011238901(A) 申请公布日期 2011.11.24
申请号 JP20110065598 申请日期 2011.03.24
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 BAEK SEUNG-HWAN;LEE YOUNG KEUN;YEO DONG-MIN;KANG UI JEONG;KWON YONG-HOON
分类号 H01L33/48 主分类号 H01L33/48
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