发明名称 |
LIGHT EMITTING DIODE CHIP AND SUPPORTING MEMBER, LIGHT EMITTING DIODE PACKAGE INCLUDING THE LIGHT EMITTING DIODE CHIP AND THE SUPPORTING MEMBER, AND LIGHT EMITTING DEVICE INCLUDING THE LIGHT EMITTING DIODE PACKAGE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting diode chip and a supporting member that can be assembled easily, a light emitting diode package including the light emitting diode chip and the supporting member, and a light emitting device including the light emitting diode package. <P>SOLUTION: A light emitting device according to the invention includes: at least one light emitting diode package; a printed circuit board; and at least one light guide plate. The light emitting diode package includes: a supporting member comprising a frame extending in a first direction and a plurality of branches branched from the frame; and light emitting diode chips, each of which is fixed between two branches adjacent with each other. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2011238901(A) |
申请公布日期 |
2011.11.24 |
申请号 |
JP20110065598 |
申请日期 |
2011.03.24 |
申请人 |
SAMSUNG ELECTRONICS CO LTD |
发明人 |
BAEK SEUNG-HWAN;LEE YOUNG KEUN;YEO DONG-MIN;KANG UI JEONG;KWON YONG-HOON |
分类号 |
H01L33/48 |
主分类号 |
H01L33/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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