METHOD OF MANUFACTURING RESIN PACKAGE, METHOD OF MANUFACTURING RESIN MODULE HAVING BUILT-IN COMPONENT, ARRANGEMENT SHEET FOR RESIN PACKAGE, AND ARRANGEMENT SHEET FOR RESIN MODULE HAVING BUILT-IN COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a means for improving an area occupancy rate of stored and built-in components.

SOLUTION: One side length j and the other side length k of a resin package, the initial thickness a0 of a resin layer before a device 12 having an area A and a thickness B is embedded, and a difference d between the device thickness B and the thickness of the resin layer of the resin package after deformation are set; a numeric value Sp having the dimension of the area that is obtained as a result of calculating a formula A*B/ä(B+d)-a0} is found; a result of calculating Sp/j is found as k2; in a resin package arrangement sheet on which the resin packages are arranged lengthwise and breadthwise, a dummy region having one side length of j and the other side length of k2-k is provided next to each region occupied by the resin package with one side interposed between so that the one side length j is commonly used, and the resin package arrangement sheet is manufactured by a layout in which the resin package and the dummy region are alternately arranged; each resin package is formed into an individual piece so that each dummy region is removed.

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