发明名称 LIGHT EMITTING DIODE CHIP FOR HIGH VOLTAGE OPERATION AND LIGHT EMITTING DIODE PACKAGE INCLUDING THE SAME
摘要 A light emitting diode (LED) chip for high voltage operation and an LED package including the same arc disclosed. The LED chip includes a substrate, a first array formed on the substrate and including n light emitting cells connected in series, and a second array formed on the substrate and including m (m≦̸n) light emitting cells connected in series. During operation of the LED chip, the first array and the second array are operated by being connected in reverse parallel to each other. Further, when a driving voltage of the first array is delined as Vd1 and a driving voltage of the second array is defined as Vd2, a difference between Vd1 and Vd2×(n/m) is not more than 2V.
申请公布号 US2011284884(A1) 申请公布日期 2011.11.24
申请号 US201013146073 申请日期 2010.02.12
申请人 LEE CHUNG HOON;SEO WON CHEOL;YOON YEO JIN;SHIN JIN CHEOL;SEOUL SEMICONDUCTOR CO., LTD. 发明人 LEE CHUNG HOON;SEO WON CHEOL;YOON YEO JIN;SHIN JIN CHEOL
分类号 H01L33/62;H01L33/50 主分类号 H01L33/62
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