发明名称 |
APPARATUS FOR MANUFACTURING LAMINATED ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING LAMINATED ELECTRONIC COMPONENT |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide an apparatus for manufacturing a laminated electronic component capable of reducing the size and cost of a facility and efficiently manufacturing the laminated electronic component with high quality and to provide a method for manufacturing the same. <P>SOLUTION: The apparatus for manufacturing a laminated electronic component comprises: a sheet conveying member 12 for continuously conveying a ceramic sheet S; a sheet cutting member 18 for cutting the ceramic sheet S to a predetermined length to form a first cut piece ST 1 and a second cut piece ST 2; a first sheet delivering member 14 for receiving the first cut piece ST 1 and the second cut piece ST 2 from the sheet conveying member 12 while rotating in the direction reverse to that of the sheet conveying member 12; a second sheet delivering member 16 for receiving the second cut piece ST 2 from the first sheet delivering member 14 while rotating in the direction reverse to that of the first sheet delivering member 14; and a sheet laminating member 20 on which the second cut piece ST 2 is transferred from the second sheet delivering member 16, after the first cut piece ST 1 is transferred from the first sheet delivering member 14. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2011238886(A) |
申请公布日期 |
2011.11.24 |
申请号 |
JP20100111479 |
申请日期 |
2010.05.13 |
申请人 |
MURATA MFG CO LTD |
发明人 |
NOGAMI HIROO;ASAKAWA TOMOAKI |
分类号 |
H01G13/00;H01G4/12;H01G4/30 |
主分类号 |
H01G13/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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