发明名称 METHOD FOR MANUFACTURING SILICON CARBIDE SUBSTRATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SILICON CARBIDE SUBSTRATE, AND SEMICONDUCTOR DEVICE
摘要 A method for manufacturing a silicon carbide substrate includes the steps of: preparing a base substrate made of silicon carbide, and a SiC substrate made of single-crystal silicon carbide; fabricating a stacked substrate by placing the SiC substrate on and in contact with a main surface of the base substrate; connecting the base substrate and the SiC substrate by heating the stacked substrate to allow the base substrate to have a temperature higher than that of the SiC substrate; and forming an epitaxial growth layer on an opposite main surface, to the SiC substrate, of the base substrate connected to the SiC substrate.
申请公布号 US2011284872(A1) 申请公布日期 2011.11.24
申请号 US201113111251 申请日期 2011.05.19
申请人 ITOH SATOMI;HARADA SHIN;SASAKI MAKOTO;SUMITOMO ELECTRIC INDUSTRIES, LTD. 发明人 ITOH SATOMI;HARADA SHIN;SASAKI MAKOTO
分类号 H01L29/24;B32B9/04;C30B19/12;C30B25/20;H01L21/20 主分类号 H01L29/24
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