发明名称 |
METHOD FOR MANUFACTURING SILICON CARBIDE SUBSTRATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SILICON CARBIDE SUBSTRATE, AND SEMICONDUCTOR DEVICE |
摘要 |
A method for manufacturing a silicon carbide substrate includes the steps of: preparing a base substrate made of silicon carbide, and a SiC substrate made of single-crystal silicon carbide; fabricating a stacked substrate by placing the SiC substrate on and in contact with a main surface of the base substrate; connecting the base substrate and the SiC substrate by heating the stacked substrate to allow the base substrate to have a temperature higher than that of the SiC substrate; and forming an epitaxial growth layer on an opposite main surface, to the SiC substrate, of the base substrate connected to the SiC substrate.
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申请公布号 |
US2011284872(A1) |
申请公布日期 |
2011.11.24 |
申请号 |
US201113111251 |
申请日期 |
2011.05.19 |
申请人 |
ITOH SATOMI;HARADA SHIN;SASAKI MAKOTO;SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
ITOH SATOMI;HARADA SHIN;SASAKI MAKOTO |
分类号 |
H01L29/24;B32B9/04;C30B19/12;C30B25/20;H01L21/20 |
主分类号 |
H01L29/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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