发明名称 DRESSING APPARATUS AND DRESSING METHOD, AND BAND SAW CUTTER
摘要 <P>PROBLEM TO BE SOLVED: To provide a dressing apparatus and a dressing method each of which highly efficiently dresses a blade of a band saw cutter so as to prevent an ingot from being warped in the cutting plane thereof and to provide the band saw cutter. <P>SOLUTION: The dressing apparatus for polishing an abrasive grain layer formed on the periphery of the circular rotary blade of the band saw cutter is characterized in that a dressing stone which is pressed to the abrasive grain layer to the direction crossing the axis of rotation of the rotary blade, is fit rotatably to a dressing apparatus body to be moved relatively to the rotary blade and that the contact surface between the dressing stone and the abrasive grain layer can be updated as the dressing apparatus body is moved. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011235371(A) 申请公布日期 2011.11.24
申请号 JP20100107039 申请日期 2010.05.07
申请人 SUMCO CORP 发明人 MAEDA SATOSHI;MATSUO KENICHI;KUSABA NOBUHIRO;MATSUO KENICHIRO;MATSUO TAKASHI
分类号 B24B53/00;B24B27/06;B28D5/04;H01L21/304 主分类号 B24B53/00
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