发明名称 |
SEMICONDUCTOR WORKPIECE CARRIERS AND METHODS FOR PROCESSING SEMICONDUCTOR WORKPIECES |
摘要 |
Semiconductor workpiece carriers and methods for processing semiconductor workpieces are disclosed herein. In one embodiment, a semiconductor workpiece carrier assembly includes (a) a support structure having an opening sized to receive at least a portion of a semiconductor workpiece, and (b) a replaceable carrier positioned at the opening. The replaceable carrier includes a base and an adhesive layer on the base. The base has a surface, and the adhesive layer covers only a section of the surface of the base. The adhesive layer releasably attaches the replaceable carrier to the support structure. |
申请公布号 |
US2011287581(A1) |
申请公布日期 |
2011.11.24 |
申请号 |
US201113094576 |
申请日期 |
2011.04.26 |
申请人 |
NEO CHEE PENG;TEO HONG HAK;SUKAMI JAMILON BIN;MICRON TECHNOLOGY, INC. |
发明人 |
NEO CHEE PENG;TEO HONG HAK;SUKAMI JAMILON BIN |
分类号 |
H01L21/50 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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