<p>A method for manufacturing a semiconductor die may have the steps of:—Providing a semiconductor substrate;—Processing the substrate to a point where shallow trench isolation (STI) can be formed;—Depositing at least one underlayer having a predefined thickness on the wafer;—Depositing a masking layer on top of the underlayer;—Shaping the masking layer to have areas of predefined depths;—Applying a photolithograthy process to expose all the areas where the trenches are to be formed; and—Etching the wafer to form silicon trenches wherein the depth of a trench depends on the location with respect to the masking layer area.</p>
申请公布号
EP2387797(A1)
申请公布日期
2011.11.23
申请号
EP20100702178
申请日期
2010.01.13
申请人
MICROCHIP TECHNOLOGY INCORPORATED
发明人
SATO, JUSTIN, H.;HENNES, BRIAN;STOM, GREG;MA, ROBERT, P.;LUNDY, WALTER, E.