发明名称 |
Ball mounting apparatus and method |
摘要 |
A device for mounting an array of solder balls to a plurality of substrates of integrated circuits, comprising: a first plate for receiving a first substrate in a loading position; said first plate adapted to translate laterally from a substrate loading position to a flux receiving position; said first plate further adapted to rotate 180° from the substrate loading position to a such that the first plate is in a solder ball receiving position, and; mounting solder balls to the first plate. |
申请公布号 |
US8061583(B2) |
申请公布日期 |
2011.11.22 |
申请号 |
US20070515900 |
申请日期 |
2007.11.22 |
申请人 |
LING NEE SENG;ANG SOO LOO;PAI TER SIANG;ROKKO VENTURES PTE LTD |
发明人 |
LING NEE SENG;ANG SOO LOO;PAI TER SIANG |
分类号 |
B23K1/00 |
主分类号 |
B23K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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