发明名称 Semiconductor device
摘要 In a substrate power supply cell, a portion of a substrate power supply wiring is exposed by forming a power supply wiring in a U-shape, and a connection portion to an upper-layer wiring is provided at a boundary portion of the substrate power supply cell. Thereby, a leakage current is reduced without a decrease in signal wiring efficiency.
申请公布号 US8063416(B2) 申请公布日期 2011.11.22
申请号 US20080255911 申请日期 2008.10.22
申请人 KISHISHITA KEISUKE;PANASONIC CORPORATION 发明人 KISHISHITA KEISUKE
分类号 H01L23/535 主分类号 H01L23/535
代理机构 代理人
主权项
地址