发明名称 |
Methods, Structures, and Designs for Self-Aligning Local Interconnects used in Integrated Circuits |
摘要 |
An integrated circuit includes a gate electrode level region that includes a plurality of linear-shaped conductive structures. Each of the plurality of linear-shaped conductive structures is defined to extend lengthwise in a first direction. Some of the plurality of linear-shaped conductive structures form one or more gate electrodes of corresponding transistor devices. A local interconnect conductive structure is formed between two of the plurality of linear-shaped conductive structures so as to extend in the first direction along the two of the plurality of linear-shaped conductive structures. |
申请公布号 |
US2011278681(A1) |
申请公布日期 |
2011.11.17 |
申请号 |
US201113189433 |
申请日期 |
2011.07.22 |
申请人 |
SMAYLING MICHAEL C.;BECKER SCOTT T.;TELA INNOVATIONS, INC. |
发明人 |
SMAYLING MICHAEL C.;BECKER SCOTT T. |
分类号 |
H01L27/088 |
主分类号 |
H01L27/088 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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