发明名称 IMAGE SENSOR WITH BACKSIDE PASSIVATION AND METAL LAYER
摘要 An image sensor includes a semiconductor layer that filters light of different wavelengths. For example, the semiconductor layer absorbs photons of shorter wavelengths and passes more photons of longer wavelengths such that the longer wavelength photons often pass through without being absorbed. An imaging pixel having a photodiode is formed near a front side of the semiconductor layer. A dopant layer is formed below the photodiode near a back side of the semiconductor layer. A mirror that primarily reflects photons of longer visible wavelengths is disposed on the back side of the semiconductor layer.
申请公布号 US2011278436(A1) 申请公布日期 2011.11.17
申请号 US201113191042 申请日期 2011.07.26
申请人 RHODES HOWARD E.;NOZAKI HIDETOSHI;OMNIVISION TECHNOLOGIES, INC. 发明人 RHODES HOWARD E.;NOZAKI HIDETOSHI
分类号 H01L27/146;B82Y20/00 主分类号 H01L27/146
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