发明名称 POLISHING SOLUTION DISTRIBUTION APPARATUS, AND POLISHING APPARATUS HAVING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a polishing solution distribution apparatus that reduces the uneven distribution of a polishing solution even when the leveling during installation is insufficient and the inclination of an installation location varies, and to provide a polishing apparatus having the same. <P>SOLUTION: The polishing solution distribution apparatus 10 includes: a conical branch body 12 that is formed with a solution pan 122 for storing a supplied polishing solution, and also, a plurality of flow passages 121 respectively connected radially to the side surface of the solution pan 122 and each having a delivery port 123 for supplying the polishing solution to a position lower than the connected position; a support portion 11 for supporting the branch body 12; and a universal joint mechanism for supporting the branch body 12 via the support portion 11 at a position higher than the gravity center of the branch body 12. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011230209(A) 申请公布日期 2011.11.17
申请号 JP20100100922 申请日期 2010.04.26
申请人 SUMCO CORP 发明人 KUROSAWA YOSHIAKI;HASHII TOMOHIRO;KAKIZONO YUICHI
分类号 B24B37/00;B24B37/08;B24B57/02;H01L21/304 主分类号 B24B37/00
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