发明名称 |
HOLDING JIG, SEMICONDUCTOR WAFER GRINDING METHOD, SEMICONDUCTOR WAFER PROTECTING STRUCTURE AND SEMICONDUCTOR WAFER GRINDING METHOD AND SEMICONDUCTOR CHIP FABRICATION METHOD USING THE STRUCTURE |
摘要 |
A backgrinding machine 10 of a semiconductor wafer W includes: a table 13 set on the working plane of a mount 11; a multiple number of holding jigs 20 arranged via check tables 15 on table 13; a grinding machine 30 for performing a grinding process of the rear side of semiconductor wafer W held by holding jig 20; and a washing device 40 for ground semiconductor wafers W. Each holding jig 20 is constructed of a concave 22 depressed on the surface of a base plate 21, a multiple number of supporting projections 23 projectively arrayed on the bottom surface of concave 22, a deformable contact film 24, covering the concave 22, being supported by the multiple supporting projections 23, for detachably holding semiconductor wafer W in close contact with it; and an exhaust path 25 for conducting air from the concave 22 covered by contact film 24 to the outside. |
申请公布号 |
US2011281509(A1) |
申请公布日期 |
2011.11.17 |
申请号 |
US20100945078 |
申请日期 |
2010.11.12 |
申请人 |
TANAKA KIYOFUMI;ODASHIMA SATOSHI;HOSONO NORIYOSHI;FUJIMOTO HIRONOBU;SEGAWA TAKESHI;LINTEC CORPORATION;SHIN-ETSU POLYMER CO., LTD. |
发明人 |
TANAKA KIYOFUMI;ODASHIMA SATOSHI;HOSONO NORIYOSHI;FUJIMOTO HIRONOBU;SEGAWA TAKESHI |
分类号 |
H01L21/304;B24B37/04;B24B41/06 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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