CHEMICAL MECHANICAL POLISHING SYSTEM

摘要

PURPOSE: A chemical mechanical polishing system is provided to improve the polishing efficiency of a rotary substrate by reciprocating and rotating a platen pad. CONSTITUTION: A polishing table(110) is rotatably installed in a frame. A substrate rotation driving unit(120) moves while mounting a substrate(55). A slurry supply unit(150) supplies slurry on the platen pad. A rotation driving motor(112) rotates the polishing table. A reciprocation driving unit(190) reciprocates the polishing plate with regard to the frame.