发明名称 |
TRANSFER ROBOT WITH SUBSTRATE COOLING |
摘要 |
Embodiments of the present invention provide a transfer robot having a cooling plate attached thereto for cooling a substrate during transfer between a processing chamber and a load lock chamber. In one embodiment, the cooling plate is a single, large area cooling plate attached to the transfer robot beneath the substrate being transferred. In another embodiment, the cooling plate is an array of substrates attached to the transfer robot beneath the substrate being transferred. The cooling plate may include a conduit path for circulating a cooling fluid throughout the cooling plate. The cooling plate may have an upper surface with a high emissivity coating applied thereto. |
申请公布号 |
WO2011090905(A3) |
申请公布日期 |
2011.11.17 |
申请号 |
WO2011US21286 |
申请日期 |
2011.01.14 |
申请人 |
APPLIED MATERIALS, INC.;KURITA, SHINICHI;INAGAWA, MAKOTO;MATSUMOTO, TAKAYUKI |
发明人 |
KURITA, SHINICHI;INAGAWA, MAKOTO;MATSUMOTO, TAKAYUKI |
分类号 |
H01L21/677;B25J15/08;B65G49/06 |
主分类号 |
H01L21/677 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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