发明名称 |
PRINTED CIRCUIT BOARD WITH SOLDER-RESIST SHIFT COUPON AND THE METHOD OF MANUFACTURING THE THEREOF, AND METHOD FOR TESTING SUBSTRATE USING THE SAME |
摘要 |
PURPOSE: A printed circuit board with solder-resist shift coupon and a method of manufacturing the thereof, and a method for testing substrate using the same are provided to determine whether a position for forming a solder resist by manufacturing a printed circuit board having a solder resist shift coupon inserted therein. CONSTITUTION: In a printed circuit board with solder-resist shift coupon and a method of manufacturing the thereof, and a method for testing substrate using the same, at least one solder resist shift coupons is included in a dummy part. The shift coupon is a polygonal conductive metal. A solder resist layer(11) is formed in the inner side of a polygonal coupon pattern. A surface processing layer(13) forms on the shift coupon pattern.
|
申请公布号 |
KR101084931(B1) |
申请公布日期 |
2011.11.17 |
申请号 |
KR20100064365 |
申请日期 |
2010.07.05 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LIM, BYOUNG WOOK;YOON, KYOUNG RO;LEE, SANG MIN;CHO, KI HEE;HEO, HYEOK |
分类号 |
H05K1/02;H05K3/28;H05K13/08 |
主分类号 |
H05K1/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|