A flexible printed circuit board includes: a substrate having a first edge and a second edge; a first wiring pattern disposed on the substrate and having a lead connection portion at a side of the first edge of the substrate; a second wiring pattern disposed on the substrate and having a lead connection portion at a side of the first edge of the substrate; a first solder pattern disposed on the lead connection portion of the first wiring pattern; and a second solder pattern disposed on the lead connection portion of the second wiring pattern and having a length longer than the first solder pattern.
申请公布号
US2011278047(A1)
申请公布日期
2011.11.17
申请号
US201113105993
申请日期
2011.05.12
申请人
YAMAUCHI YASUYUKI;YAMAJI KAZUHIRO;ABE TSUTOMU;IIZAKA SHINYA;SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.;SUMITOMO ELECTRIC INDUSTRIES, LTD.