STACK TYPE SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A stacked semiconductor package is provided to accomplish the miniaturization of a package product by manufacturing without securing the clearance height of a molding unit in an upper region. CONSTITUTION: A first semiconductor chip(121) is laminated on a first substrate(111) to multi-stage. A second semiconductor chip(131) is laminated on a second substrate(112) to multi-stage. A first conductive wire(140) electrically interlinks a first bonding pad(122) and a connection pad of the first substrate. A second conductive wire(150) electrically interlinks a connection pad of the second substrate and a second bonding pad(132). A junction unit(190) laminates and welds first and second lamination by having a connection bonding layer of a constant thickness.