| 摘要 |
PURPOSE: An image sensor package and a manufacturing method thereof are provided to arrange a support mold layer with a liquid synthetic resin solidifying method, thereby manufacturing smaller image sensor package. CONSTITUTION: An image sensor chip(200) is combined with a wire bonding process by being mounted on a printed circuit board(100). A protection dam(300) is arranged according to the upper boundary edge part of the image sensor chip. A protection cover(400) is arranged in order to be separated to an upper direction from the image sensor chip. A support mold layer(500) is arranged into a shape covering the outer boundary of the image sensor chip along the protection cover. The support mold layer seals a cavity between the protection cover and image sensor chip. |
