发明名称 Method of contact coating a microneedle array
摘要 A method of coating a microneedle array by applying a coating fluid using a flexible film in a brush-like manner. A method of coating a microneedle array comprising: providing a microneedle array having a substrate and a plurality of microneedles; providing a flexible film; providing a coating solution comprising a carrier fluid and a coating material; applying the coating solution onto a first major surface of the flexible film; performing a transfer step of bringing the first major surface of the flexible film into contact with the microneedles and removing the flexible film from contact with the microneedles; and allowing the carrier fluid to evaporate. Also, a method of coating a microneedle array by applying a coating solution onto a first major surface of a coating substrate to form a layer of applied coating solution having a thickness equal to or less than the height of at least one of the microneedles and performing a transfer step of bringing the first major surface of the coating substrate into contact with the microneedles and removing the coating substrate from contact with the microneedles, thereby transferring at least a portion of the coating solution to the microneedle array.
申请公布号 US8057842(B2) 申请公布日期 2011.11.15
申请号 US20050718474 申请日期 2005.11.18
申请人 CHOI HYE-OK;KNUTSON GORDON P.;DAVID MOSES M.;3M INNOVATIVE PROPERTIES COMPANY 发明人 CHOI HYE-OK;KNUTSON GORDON P.;DAVID MOSES M.
分类号 B05D3/02;A61B17/20;A61M5/32;A61M37/00;G01N1/00 主分类号 B05D3/02
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