| 摘要 |
Provided is a multilayer printed wiring board (1) in which multiple via holes (4 to 7) that connect a first power supply wiring (2) with a second power supply wiring (3) are aligned in a line in parallel to a direction along which current flows. In order to prevent current from being concentrated on the via hole (4) connected to a farthest end of the power supply wiring (2) among the via holes (4 to 7), a narrow portion (8) between the via hole (4) and the via hole (5) is narrowed to increase a resistance. A narrow portion (9) that is narrowed is disposed similarly at a farthest end of the power supply wiring (3) of the second conductor layer. |
