| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic component package that is used for obtaining a smooth inner peripheral face by setting inclination of the inner peripheral face of a frame surrounding a cavity for storing an electronic component at a desired angle. <P>SOLUTION: The method for manufacturing an electronic component package is used for manufacturing a package in which at least part of the inner peripheral face of a frame is sloped surrounding the cavity for storing the electronic component. A die 6 used in a process for pressing a plurality of ceramic green sheets 13 as the frame is provided with a protrusion 61 protruding from a base 60. The side faces 62 inclined to the protruding direction of the protrusion 61 are formed to the protrusion 61. Each inclination angle of the side faces 62 corresponds to the inclination angle of the inner peripheral face of the frame. The protrusion 61 of the die 6 is press-fitted into through-holes 15 of the ceramic green sheets 13 by pressing a plurality of the ceramic green sheets 13 by using the die 6. <P>COPYRIGHT: (C)2007,JPO&INPIT |
