WAFER LEVEL BONDING DEVICE

摘要

PURPOSE: A wafer level bonding apparatus is provided to easily clean and repair the inner space of a vacuum case through a gate door by forming a separate gate door in the side of the vacuum case. CONSTITUTION: A vacuum chamber(C) is placed in a vacuum case(100). A plurality of bonding heads(200) is combined with the upper side of the vacuum case through a bolt(P). The plurality of the bonding stages is connected to the lower side of the vacuum case by penetrating the vacuum case. A guide tube(300) is independently combined with the bonding head to supply a gas to the inside of the vacuum chamber in the top side of the vacuum case. A separate connection pipe is arranged in a gate door(120) to be communicated with the vacuum chamber.