| 摘要 |
<P>PROBLEM TO BE SOLVED: To accomplish electrical connection of each semiconductor chip securely and reduce the manufacturing cost by simplifying the manufacturing process. <P>SOLUTION: A semiconductor device has a semiconductor chip of three or more stacked layers, a through electrode so disposed as to penetrate each semiconductor chip in the thickness direction, and a land. The land is so disposed as to surround the through electrode within each semiconductor chip and to be in contact with the semiconductor chip. A semiconductor device manufacturing method has a step of so forming a throughhole within each wafer as to penetrate each wafer in the thickness direction and to be surrounded by the land, and a step of forming the through electrode in the throughhole. <P>COPYRIGHT: (C)2012,JPO&INPIT |
