发明名称 REMOVING A SHEET FROM THE SURFACE OF A MELT USING ELASTICITY AND BUOYANCY
摘要 Embodiments related to sheet production are disclosed. A melt of a material is cooled to form a sheet of the material on the melt. The sheet is formed in a first region at a first sheet height. The sheet is translated to a second region such that it has a second sheet height higher than the first sheet height. The sheet is then separated from the melt. A seed wafer may be used to form the sheet.
申请公布号 US2011272115(A1) 申请公布日期 2011.11.10
申请号 US201113039808 申请日期 2011.03.03
申请人 VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC. 发明人 KELLERMAN PETER L.;SUN DAWEI;HELENBROOK BRIAN;HARVEY DAVID S.
分类号 B22D23/00 主分类号 B22D23/00
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