METHOD FOR MANUFACTURING CERAMICS SUBSTRATE AND SEMICONDUCTOR PACKAGE USING THE SAME

摘要

PURPOSE: A method for manufacturing a ceramic substrate and a semiconductor package using a ceramic substrate are provided to increase optical efficiency without a plating process by forming a reflecting surface using the high reflecting material including a material which is similar to the substrate body. CONSTITUTION: A lower ceramic substrate(38) is prepared. A cavity is sloped toward the lower ceramic substrate and is punched in a top ceramic substrate(44). A molding body is formed by coating a ceramic material in the inclined side of the cavity and has the reflecting surface(46) of the ceramic material. The molding body is laminated on the lower ceramic substrate. The lower ceramic substrate and a laminated molding body are integrated with a thermal process.