REAR-SURFACE FILM FOR FLIP-CHIP SEMICONDUCTOR

摘要

PROBLEM TO BE SOLVED: To provide a rear-surface film for a flip-chip semiconductor and a dicing tape integrated rear-surface film for semiconductor that can suppress or prevent the warp of a semiconductor element which is mounted onto an adherend by flip chip.

SOLUTION: A rear-surface film for a flip-chip semiconductor to be provided for a rear surface of a semiconductor element which is mounted on an adherend by flip chip has a tension storage elastic modulus at 23°C after thermal curing of 10 GPa or more and 50 GPa or less.

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