| 摘要 |
A cooling system for a microchip or other component is described, including, in one embodiment: (1) a cold plate assembly positioned adjacent (e.g., in contact with) the component to be cooled; (2) at least one heat exchanger; (3) a fan for directing gas adjacent (e.g., through) a portion of the heat exchanger; and (4) a pump for circulating cooling fluid through a closed circuit including the cold plate and heat exchanger. The cold plate may include guide fins that define macrochannels and microchannels that serve as conduits for the cooling fluid. The fins and channels in one embodiment are shaped to substantially match the heat map profile of the chip or component to be cooled. The heat exchanger in one embodiment includes a reservoir in its base which may cooperate with a recess or channel in a support plate to form an additional cooling fluid flow passage.
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