发明名称 SOLDER RESIST COMPOSITION AND PRINT CIRCUIT BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a solder resist composition which has high reflection rate and high resolution and prevents the decrease of the reflection rate due to color degradation and to provide a print circuit board obtained by forming a solder resist by using the solder resist composition. <P>SOLUTION: A solder resist composition includes (A) a resin containing carboxyl groups, (B) a photopolymerization initiator based on bisacylphosphine oxide, (C) a photopolymerization initiator based on monoacylphosphine oxide, (D) a melamine or its derivative, (E) a photopolymerizable monomer, (F) a rutile type titanium oxide, (G) an epoxy compound and (H) an organic solvent. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011227308(A) 申请公布日期 2011.11.10
申请号 JP20100097254 申请日期 2010.04.20
申请人 TAIYO HOLDINGS CO LTD 发明人 YODA AIKO;NOSAKA ASAMI;SHIMAMIYA AYUMI;USHIKI SHIGERU
分类号 G03F7/004;C08F2/44;C08F120/20;C08F265/02;G03F7/029;G03F7/038;H05K3/28 主分类号 G03F7/004
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