HEAT CONDUCTING DEVICE AND ELECTRONIC DEVICE APPLYING THE SAME

摘要

A heat conducting device (500) comprises a first heat conducting board (510) and a heat conducting structure (530). The first heat conducting board (510) comprises an upper heat conducting arm (520) provided on the surface thereof. The heat conducting structure (530) and the upper heat conducting arm (520) of the first heat conducting board (510) slidingly butt against each other, thereby forming a contacting surface through which heat transfers. The heat conducting structure (530) comprises a heat conducting surface (531). The heat conducting structure (530) is used to maintain the relative position between the first heat conducting board (510) and the heat conducting surface (531), and the distance between the first heat conducting board (510) and the heat conducting surface (531) of the heat conducting structure (530) can be adjusted by the relative slide between the upper heat conducting arm (520) and the heat conducting structure (530), and the contacting surface through which heat transfers always exists between the upper heat conducting arm (520) of the first heat conducting board (510) and the heat conducting structure (530).