| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a defect correcting apparatus capable of correcting a large-sized defect by efficiently polishing in an optimum sequence. <P>SOLUTION: The defect correcting apparatus uses: a polishing head (40) that includes a polishing tape transport device; an optical head (47) that has a confocal imaging device; and a correcting head, on which a position sensor (34) for detecting a position in a Z-axis direction with respect to a workpiece surface is mounted. A controller (50) for controlling polishing by means of the polishing head has: a means (54) of generating a two-dimensional height map of the workpiece surface by using an image signal output by the confocal imaging device and position information in the Z-axis direction output by the position sensor; and a scheduling means (55) of generating a schedule that specifies the address of a portion to be polished on the workpiece surface and the polishing sequence on the basis of the generated two-dimensional height map. Polishing is automatically performed on the basis of the generated schedule. <P>COPYRIGHT: (C)2012,JPO&INPIT |
