| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for producing a circuit board, reducing the time consumption of the production method and improving reliability. <P>SOLUTION: A method for producing a circuit board includes the steps of: bonding the peripheries of two metal layers to form a sealed area; forming two insulating layers on the two metal layers; forming two conductive layers on the two insulating layers, the conductive layers including upper and bottom portions; laminating the two insulating layers and the two conductive layers to embed the two metal layers, which are bonded to each other, between the two insulating layers; removing a part of the two insulating layers and a part of the two conductive layers to form a plurality of blind holes exposing the two metal layers; forming a conductive material in the blind holes and on the remaining two conductive layers; and separating the sealed area of the two metal layers to form two separate circuit boards. <P>COPYRIGHT: (C)2012,JPO&INPIT |
