| 摘要 |
<P>PROBLEM TO BE SOLVED: To search a high resolution image of a semiconductor integrated circuit and to narrow down failure spots with high precision. <P>SOLUTION: The failure analysis apparatus comprises an X-ray generating part for irradiating X-ray to the semiconductor integrated circuit; a movable scintillator for transforming x-ray transmitting through the semiconductor integrated circuit into light; and a photodetection part for detecting the light transformed by the scintillator and a photoemission light generated from the semiconductor integrated circuit in which a voltage is applied. <P>COPYRIGHT: (C)2012,JPO&INPIT |
