发明名称 |
Packages, biochip kits and methods of packaging |
摘要 |
A package having an improved yield is provided. The package includes a support on which a plurality of biochips are disposed, and a cover bonded to the support and defining a reaction space for each of the plurality of biochips together with the support, the cover including at least one inlet/outlet.
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申请公布号 |
US8052941(B2) |
申请公布日期 |
2011.11.08 |
申请号 |
US20080217169 |
申请日期 |
2008.07.02 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE JUNE-YOUNG;LEE DONG-HO |
分类号 |
G01N21/75;B65B7/00;C12M1/34 |
主分类号 |
G01N21/75 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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