发明名称 |
Method of fabricating a solder pad structure |
摘要 |
A method for fabricating a solder pad structure. A circuit board having thereon at least one copper pad is provided. A solder resist is formed on the circuit board and covers the copper pad. A solder resist opening, which exposes a portion of the copper pad, is formed in the solder resist by laser. The laser also creates a laser activated layer on sidewalls of the solder resist opening. A chemical copper layer is then grown from the exposed copper pad and concurrently from the laser activated layer.
|
申请公布号 |
US8051560(B2) |
申请公布日期 |
2011.11.08 |
申请号 |
US20090580256 |
申请日期 |
2009.10.16 |
申请人 |
UNIMICRON TECHNOLOGY CORP. |
发明人 |
TSENG TZYY-JANG;CHIANG SHU-SHENG |
分类号 |
H01K3/10 |
主分类号 |
H01K3/10 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|