| 摘要 |
A multiple integrated circuit arrangement within a single package is provided. The multiple integrated circuit arrangement includes a set of electronic components, which includes at least a set of dies. The first die of the set of dies is coupled to a first electronic component of the set of electronic components, wherein the first electronic component is not the first die. The arrangement includes a built-in-self-test (BIST) arrangement, which is at least partly encapsulated within the single package, wherein the BIST arrangement is configured for at least testing the first die of the set of dies. The arrangement also includes a built-in-self-repair (BISR) arrangement, which is at least partly encapsulated within the single package, wherein the BISR arrangement is configured for at least repairing the multiple integrated circuit arrangement. |
