PHOTOSENSITIVE RESIN COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition to which the patterning can be performed and which exhibits adhesiveness even after hardening.

SOLUTION: A photosensitive resin composition includes (1) 100 parts by mass of (meth)acryl polymer having a carboxyl group and a reactive double bond in a side chain, an acid number of 65-180 KOHmg/g and the content of the reactive double bond of 0.5-18 mol% with respect to 100 mol% of the content of all monomer units in the polymer and (2) 0.5-10 parts by mass of a photopolymerization initiator.

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