| 摘要 |
<P>PROBLEM TO BE SOLVED: To properly detect occurrence of cracks under a bonding pad due to connection of a wire in a semiconductor substrate having on its one surface the bonding pad to which the bonding wire is connected. <P>SOLUTION: In a semiconductor substrate 1, an inspection wiring 40, which inspects characteristics of the semiconductor substrate 1, is provided under a bonding pad 10. The inspection wiring 40 is disposed directly under the portion where the edge of a bonding wire 70 is located in the bonding pad 10. <P>COPYRIGHT: (C)2012,JPO&INPIT |
