WAFER HEATING HEATER UNIT AND SEMICONDUCTOR MANUFACTURING APPARATUS MOUNTED WITH THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a wafer heating heater unit having excellent temperature uniformity and reliability and to provide a semiconductor manufacturing apparatus mounted with the wafer heating heater unit.

SOLUTION: The wafer heating heater unit comprises a placing base including a wafer placing surface, and a supporting plate including a resistance heating unit on the opposite surface to the wafer placing surface and supporting the placing base and the resistance heating unit. The resistance heating unit comprises heating element and a plurality of insulating layers that sandwich the heating element. A groove is formed in at least one of the insulating layers. The heating element is seated within the groove and is sandwiched with the other insulating layers. The insulating layers have a region in which the insulating layers are not adhered to each other. The insulating layers are preferably not adhered to each other.

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