| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive polyimide resin composition which has excellent sensitivity in i-ray (365 nm) exposure and a high-resolution, with which the development in alkali water solution can be performed and which can form a good relief pattern. <P>SOLUTION: A positive photosensitive polyimide resin composition includes a polyimide resin which is obtained by using a salt of a predetermined phenylenediamine derivative as a diamine component and an alicyclic tetracarbon acid dianhydride as an acid component and performing an imidization of these components in the presence of a reductant with a standard oxidation reductive potential of -0.20 Volt to 0.34 Volt, and a photosensitive component. <P>COPYRIGHT: (C)2012,JPO&INPIT |
