| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solder layer forming method for suppressing dispersion of a solder component, a wiring board connecting method and a wiring board connecting device. <P>SOLUTION: In the solder layer forming method, cream solder is printed on a wiring pattern formed on a wiring board, the printed cream solder is irradiated with spot light, solder included in the cream solder is molten and a solder layer is formed on the wiring pattern. The connecting method and the connecting device of the wiring board are provided. The connecting device 10 of the wiring board includes a light source 13 irradiating the cream solder with the spot light and a control portion 19 controlling an energy amount per unit time and unit area of the spot light with which the light source irradiates the cream solder. <P>COPYRIGHT: (C)2012,JPO&INPIT |
