IMAGE SENSOR MODULE HAVING IMAGE SENSOR PACKAGE

摘要

PURPOSE: An image sensor module which includes an image sensor package is provided to include a heat dissipation plate covering the image sensor package, thereby effectively radiating heat from the image sensor package. CONSTITUTION: A circuit board(110) comprises an upper surface(112) and a lower surface(114). An image sensor package(200) comprises a mounting substrate(210) and an image sensor chip(220). The image sensor chip is mounted on the upper surface(202) of the mounting substrate. The mounting substrate comprises a heat dissipation substrate(214) and a circuit board(212). A transparent member(250) is included in the upper part of the image sensor chip. A holder(240) supports the transparent member.