| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing composition which can be used for polishing in order to form wiring of a semiconductor device and a polishing method using thereof. <P>SOLUTION: A polishing composition of the present invention has a polishing promoter, a hydrosoluble polymer containing structural units from polymerizable compounds having a guanidine configuration such as dicyandiamide, and a oxidizer. The hydrosoluble polymer can contain structural units from dicyandiamide and structural units from formaldehyde, diamine, or polyamine. <P>COPYRIGHT: (C)2012,JPO&INPIT |
