| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a dividing method of a package substrate for preventing occurrence of clogging or dulling in a cutting blade by cutting a substrate and for shortening cutting time. <P>SOLUTION: In a surplus coupling portion removing step, a surplus coupling portion 45 is removed at first and only device portions 42, 43 and 44 are cut and are divided into devices in a device portion dividing step. Since the surplus coupling portion 45 is not cut in the device portion dividing step, clogging and dulling of the cutting blade 31 hardly occur. In the device portion dividing step, relative movement of the respective device portions and the cutting blade 31 is started and only the device portions are cut with work starting points of the device portions 42, 43 and 44 as reference. Thus, a relative moving distance of the cutting blade 31 and the package substrate 4 becomes shorter compared to a case when the surplus coupling portion 45 and the device portions 42, 43 and 44 are continuously cut, and cutting time can be shortened. <P>COPYRIGHT: (C)2012,JPO&INPIT |
