| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thin light emitting device preventing a crack in a bonding part due to a difference of a thermal-expansion coefficient between a submount substrate and a wiring board. <P>SOLUTION: A terminal member 4 is arranged along at least one side of a first substrate 2 on which a semiconductor light emitting element 1 is loaded. A part of the terminal member 4 is brought into contact with an electrode 24 on an upper face of the first substrate 2 and the other part is brought into contact with an electrode 31 on an upper face of a second substrate 3. The terminal member 4 electrically connects the first substrate 2 and the second substrate 3. The terminal member 4 and the second substrate 3 have the same base materials. A conductive resin layer 6 is disposed in a part where the terminal member 4 is brought into contact with the first substrate 2, and a solder layer 7 is arranged in a part where the terminal member 4 is brought into contact with the second substrate 3. Since the second substrate 3 and the terminal member 4 have the same base materials, stress due to thermal expansion is not applied to the solder layer 7. Stress due to thermal expansion between the first substrate 2 and a frame body 4 is absorbed by the conductive resin layer 6. <P>COPYRIGHT: (C)2012,JPO&INPIT |
