| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an optical semiconductor element module which is able to seal enough optical semiconductor elements while reducing the manufacturing cost. <P>SOLUTION: A semiconductor laser 4 is mounted on a stem 1. A cap 5 is fixed to the stem 1 to cover the semiconductor laser 4. A plastic lens 6 and a glass plate 7 are attached to the cap 5. The plastic lens 6 focuses emitted light from the semiconductor laser 4. The glass plate 7 seals the semiconductor laser 4. By using the glass plate 7, the semiconductor laser 4 can be sealed sufficiently. The manufacturing cost can be reduced by using the plastic lens 6. <P>COPYRIGHT: (C)2012,JPO&INPIT |
