METHOD FOR MANUFACTURING RESIN MOLDED ELECTRONIC COMPONENT, AND RESIN MOLDED ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To achieve stable continuous production of a resin molded electronic component by preventing nozzle clogging during resin molding.

SOLUTION: The method for manufacturing a resin molded electronic component includes: arranging an element in a cavity 15 of a first mold that includes the cavity with its top face opened;injecting a main agent 17 containing a norbornene resin and a catalyst-containing curing agent 19 into the cavity 15 from separate nozzles; and arranging a second mold on the first mold so as to cover the cavity 15 to cure the norbornene resin. The norbornene resin is not cured in the nozzle, thereby preventing nozzle clogging to enable stable continuous production of the resin molded electronic component.

COPYRIGHT: (C)2012,JPO&INPIT